DOWSIL™ ME-1070 SILICONE DIE ATTACH BLACK,30G-SYR
One Part/No byproducts/Low modulus
Contact us
Description
DOWSIL™ ME-1070 Application description： Die attach adhesive for microelectronics packaging.
Additional information
| Brand | DOWSIL |
|---|---|
| Manufacturer SKU | 99157889 |
| Application | Chip Coating |
| Market application | General Industry |
| Mix Ratio by Weight | One Part |
| Material | SILICONE |
| Color/Appearance | Black |
| Viscosity (mPa.s) | 20,000 |
| Tack-Free Time | 24 mins @ 25℃ |
| Cure Condition | 30 mins @ 150℃ |
| Specific Gravity | 1.2 |
| Hardness (Shore) | 72 (A) |
| Tensile Strength (psi) | 500 |
| Dielectric Strength (KV/mm ) | 19 |
| Volume Resistivity (ohm*cm) | 2.10E+15 |
More Information
If you want to know more about the use of the product or related certification, such as UL,RoHS,REACH,European Union Regulations, Please make use of the inquiry form or telephone.
